HCLTech has released a whitepaper developed by research firm Omdia examining Taiwan’s role in the semiconductor supply chains underpinning AI infrastructure, as the industry shifts from standalone chips to integrated platforms combining compute, memory, connectivity, packaging and software.
Titled AI Semiconductor Platforms: Powering the Next Wave of Global Growth – An Asia Pacific Perspective, the paper says Taiwan-headquartered foundries account for more than half of the global foundry-services market, while Taiwanese original design manufacturers produce about 90% of the world’s server motherboards. It also cites Omdia estimates that TSMC accounts for more than 90% of the world’s leading-edge semiconductor production.
“AI semiconductor competition is no longer about who builds the fastest chip, but who delivers the best workload outcome. Performance now depends on compute, memory, packaging, connectivity and software being designed together from the start. That makes execution the real differentiator – the leaders will be those who can turn complex silicon ambition into scalable, production-ready platforms,” said Ameer Saithu, Executive Vice President & Global Head, Semiconductor Business, HCLTech.
“Taiwan’s role in AI goes well beyond making chips. Its depth, from wafers to racks, spanning leading-edge manufacturing, advanced packaging and server production, is very hard to replicate. Even as capacity spreads across Asia, Taiwan remains the centre that connects it all, and the opportunity now is to turn that strength into faster, more resilient AI deployment,” said Terry Tai, Country Head of Taiwan, HCLTech.
“As hyperscalers accelerate investment in custom AI silicon, Taiwan’s semiconductor ecosystem is becoming even more important to the global AI infrastructure value chain. HCLTech combines its global silicon engineering experience with a deep understanding of Taiwan’s semiconductor ecosystem to help customers turn increasingly complex AI chip designs into scalable, manufacturable products. Working closely alongside customers’ engineering teams gives us a practical view of what it takes to move from design intent to volume production,” noted Hong Ming Chang, Senior Director, Taiwan, HCLTech.
The whitepaper highlights the growing importance of advanced packaging and system-level integration. It points to technologies such as TSMC’s CoWoS, and says ASE Technology Holding holds roughly 40% of the global outsourced semiconductor assembly and test market.
The paper also describes a trend toward rack-scale AI systems, citing NVIDIA’s GB200 NVL72 as an example integrating 72 GPUs and 36 CPUs within a single liquid-cooled rack, and argues this increases the need for coordinated design across compute, connectivity, power and cooling.
While positioning Taiwan as central to the AI semiconductor value chain, the paper also points to a more distributed Asian ecosystem, naming Singapore, Malaysia, Vietnam and China as contributors across manufacturing, packaging, testing and equipment production.
You can read the full report here.
